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| ·Other semiconductor devices |
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| ·Semiconductor-related supplies |
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| The wafer press fits the equipment |
| The radio station can provide an even controllable temperature and the pressure then carries out the wafer to press fit the craft. the metal linkage (Metal Bonding), the agglutination (Glue Bonding), the anode linkage (Anodic Bonding) SOI the different agglutination medium each must have the different technological conditions to complete, cello the Taichi series wafer press fits the equipment to be possible to provide the match the external mold train to complete the different domain the technical utilization (Led, LD, MEMS, WLP, 3D Package, Lens, SOI, KOS, PV). How just does the deformation quantity drop to lowly, the Taichi series wafer will press fit the equipment (Wafer Bonder) to find window of that leaf of path perfect wafer linkage for you. |
| The wafer press fits the equipment |
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