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Large-scale heated air circulation drying oven
Great size (22 ") photo exposure machine
Perpendicular photo exposure machine

1, exposing lamp source

 high pressure mercury lamp power 350W;

to make public photo source size: 10cmX10cm;

 photo source wave length: NUV (including 365nm,400nm,435nm);

 uniformity: + in -5%;

 power source supply: 350W,has the power regulation hypothesis function;

 the photo source position fixed does not move;

2, phantom system

two 7 time of invariable percentage lens, enlargement time of 50X-350X

 double CCD phantom system, two 9 " black and white screen;

 has the coaxial photo source; to time spacing 3.5cm-15cm;

about the lens position may right do on time, around adjusts up and down, about the base actuates by the air cylinder, to do moves;

3, to make public alignment

tool the light covers the vacuum cup: 5 " c up-draft;

wafer vacuum cup: 4 ", may operate 4 ", 3 " the wafer and the broken piece, have the place to time;

has moves the light cover, the wafer horizontal adjustment function adjustable lays the grain the cover, vacuum of adsorptive attraction size the wafer;

the to make public pattern has the vacuum contact type and recently received -like;

the X, Y axis adjusts 12mm. The Z axis adjusts 5mm, adjusting characterist 2um;

 the alignment tool actuates by the air cylinder, to proceed to make the alignment movement, will make to make public movement in the future;

4, operating system

manual operation kneading board;

has the light to cover the vacuum, the wafer vacuum, dial gage of timer time setting the adsorption vacuum: 0.1-999 second;

foolproof function;

5, seat-s on a plane

installs has the quakeproof air cushion, has shocks proof the function good;

installs has the adjustment foot place and the wheel, facilitates the localization;

6, performance

picks the vacuum contact to make public graph analysis to be possible to reach in 1 um;

picks recently received -like to make public approximately in 5-10um;

Touches controls may the program photoresistor coating machine (desk-top)
Wet bench
Spin wash landing wafer clearer
LED street light 110W

 
3W high efficiency series
型号
颜色
压降(V)
光通量(LM)
波长(nm)/色温(K)
视角
IF=700mA
IF=700mA
IF=700mA
IF=700mA
XM-03RXXL-XXXXX
2.0~3.0
70~100
620~630
60/90/120/140/175
XM-03YXXL-XXXXX
2.0~3.0
60~90
585~595
60/90/120/140/175
XM-03GXXL-XXXXX
绿
3.0~4.0
90~140
515~535
60/90/120/140/175
XM-03BXXL-XXXXX
3.0~4.0
20~30
450~475
60/90/120/140/175
XM-03WXXL-XXXXX
3.0~4.0
120~220
2700~10000
60/90/120/140/175
1W high efficiency series
型号
颜色
压降(V)
光通量(LM)
波长(nm)/色温(K)
视角
IF=350mA
IF=350mA
IF=350mA
IF=350mA
XM-01RXXL-XXXXX
2.0~3.0
30~60
620~630
60/90/120/140/175
XM-01YXXL-XXXXX
2.0~3.0
30~60
585~595
60/90/120/140/175
XM-01GXXL-XXXXX
绿
3.0~4.0
50~80
515~535
60/90/120/140/175
XM-01BXXL-XXXXX
3.0~4.0
8~20
450~475
60/90/120/140/175
XM-01WXXL-XXXXX
3.0~4.0
60~110
2700~10000
60/90/120/140/175
Plasma chemistry gas phase auxiliary deposition equipment
Aegis is a unique new plasma enlargement mode chemistry gas phase deposition system, the design uses by silicon-based on the thin film deposition (SiO2, SiNx, SiOxNy, a-SixHy). This system has provided the plasma chemistry gas phase auxiliary deposition system standard function in the very compact space. The computer touchscreen provided a friendly operation contact surface to use by the connection parameter control and the system regulation memory. This system is the superelevation brightness LED chip large scale production ideal choice. application:
(1) deposits the silica (SiO2)
(2) to deposit the silicon nitride (SiNx)
Responds the ion sculpture equipment
The Nasca series radio station is a high performance, comprehensively based on PC automatic operation response plasma sculpture equipment. This equipment completes the control by the computer and the touchscreen to be advantageous for the parameter control and the system regulation memory. According to the system regulation's difference, may dispose Cheng Fu and the chlorine is the chemical substance sculpture. The craft wafer greatest size may amount to 8 inches. Nasca may in have under the smallest side damage the sculpture small design. application:
(1) suits the medium membrane, the metallic film, the compound materials and silicon-based bottom
(2) may sculpture submicron pattern semiconductor wafer (
3) manufacture miniature machinery
(4) concave-convex/electric circuit sculpture
ITO electron gun evaporation equipment
The system mainly aims at the volume production as well as the long time stable ITO coating system regulation, its biggest chip size may amount to 12 inches. the system mainly includes the chip load bearing system, the heating system, the electron gun evaporation system, the vacuum control system, the vacuum supervisory system, the membrane thick supervisory system and the software PC operating system and so on.



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